Honda transferred the AI ​​R&D center to Tokyo, which is to replace Silicon Valley?
The Japan Times reported that Honda has chosen to establish a new artificial intelligence center in Tokyo instead of Silicon Valley thousands of miles away. Honda's new Tokyo R&D center will focus on artificial intelligence research, which will house Honda's AI R&D teams around the world, including R&D teams in California and Germany, which may bring some Silicon Valley talent in a short-term contract.
Honda believes that AI is the cornerstone of future mobile products. Artificial intelligence driving requires many different technologies, such as robots, navigation, connections, etc. Honda believes that AI can use them in a coordinated manner. The company chose Tokyo instead of Silicon Valley as the location of the company's artificial intelligence development center because it is close to the rest of the company. Honda hopes that most teams will collaborate on the development of highly demanding products in the same location, especially when it comes to autonomous driving.
Honda also believes that Japanese talent is as capable as the talents of the San Francisco Bay Area. Honda even offers non-traditional work and salary systems to attract talent from other industries.
Printed circuit boards which are used in medical industry.
The manufacturing method of the multi-layer board is generally performed by the inner layer pattern, and then formed into a single-sided or double-sided substrate by printing etching, and is incorporated into a specified layer, and then heated, pressed and bonded, as for the subsequent drilling. The hole is the same as the plated through hole method of the double panel.
The equipment and processes required for multi-layer boards are more complex and high-end. When designing the size of multi-layer boards, it is often necessary to consider more factors, especially the size of the equipment, whether it can allow such large size.
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