[Speech Record] Getian Optoelectronics Zheng Xiantao: Flip Chip Module Challenges Professional Segmentation Lighting Market
This article is the speech of Zheng Xiantao, General Manager of Getian Optoelectronics LED Business Unit at the 2014 High-Tech LED Annual Conference “On the Great Strategy of the Industryâ€.
Zheng Xiantao emphasized that in the future, the realization of downward and outward extension, continuous innovation and change of mode, complementation of strong and strong joint advantages, and transformation from manufacturing service industry will become a direct and higher-speed train for LED packaging enterprises.
The following is the full text of Zheng Xiantao's speech:
Good afternoon, my colleagues.
I am very fortunate to be able to share some of my personal experiences with this platform. This is the first time that Getian has appeared in such a workplace. It has been a relatively low-key way and has been in the industry for ten years. The theme I brought today is "Flip-chip".
What new opportunities can the flip chip package bring to the market today? This is also the question that Getian began to think about three years ago. Because in the field of packaging, a product, a product has been done for almost ten years, in which direction does the package go?
Getian has always been doing some applications in the field of outdoor lighting, and also knows that outdoor lighting is very demanding on the stability of LED products, and it is suitable for different environments.
Another eternal theme is how to make it stable and cheap. Based on this starting point, I started researching the work of flip chip products three years ago.
What I brought today is also the product of Getian in the past three years. This product has gained some experience in the market.
My speech is divided into four major sections:
The first is the comparison of flip chip and traditional package.
Getian's point of view, flip chip packaging, or flip-chip, future application innovation. This is something we have a deep understanding of, can be unlimited innovation, and its stability, not to mention, cost-effective, the future cost space is very huge. It may not be imagined that if this thing is used on a street lamp to realize 3 yuan per watt, if all aspects of the package are in place, it must be realized.
As long as the downstream field wants to get it, I can do it. Of course, the future market expansion is infinite, and the reason is also based on the fact that stability has not been applied by the LED segment.
First look at the material, this material is also the core of the chip, we all know at a glance, Dr. Xiao just said very clearly.
The traditional chip is glued, but we are.
The gold-tin crystal process quickly fixes the chip by nearly 300 degrees of high temperature, while the traditional one takes a long time and the temperature is more than 120 degrees. The difference in thermal conductivity between silver paste, thermal conductivity and alloy material is close to 54 times. The thickness of the solid crystal silver paste is 30 microns in the middle of the chip, and the alloy is only 3 microns, which means that the heat in the middle is exported faster. There is also a special place where the solid crystal is stable. The thrust of the silver plastic package is 500 grams, while the soldering thrust of the fine tin crystal is at least 2000 grams.
The thermal conductivity of the substrate and ceramic is very high, and the thickness is also very high. The expansion coefficient is basically close to the expansion coefficient of the sapphire of the chip, which indicates that the internal stress generated by the chip after heat resistance causes the chip to be caused. The destruction has made this probability much lower.
The process of packaging, the conductive is gold-free, that is, package-free, eliminating the gold wire, that is to say, the positive and negative conductive cross-sectional area of ​​the traditional positive-loading chip may be 2.265 square meters. The bonding pressure is also the same, especially in the way the phosphor is applied, which is definitely affected by the gold wire, which has some effect on our coating method. At the top of the chip, when there is no gold wire, we can really play freely, whether it is a spray or a process mode.
In the packaging equipment, you may know that basically the wire bonding machine is basically not used, the efficiency will be greatly improved, one is the coating method of the phosphor, and the free gold wire will also make the efficiency much improved.
That is to say, the entire packaging process, packaging labor costs are reduced a lot.
The thermal resistance of the flip chip product is very low, and the solder layer of the alloy itself is very thin, which is directly transmitted by the heat between the electrode and the bottom plate, and also eliminates the risk of leakage of silver glue to the periphery of the chip. There is no such thing in the process of flip chip.
Looking at the streetlight modules that everyone can see on the market today, the assembly is more complicated, and the cost is definitely relatively difficult. In terms of labor cost and stability, it is difficult to make breakthroughs and changes, but if we use flip chip To replace it, first of all, it can reduce its volume, because the temperature resistance of this product is very high, so after the volume is small, the heat dissipation requirement will be high, the volume can be done very well, and the volume can be reduced. Half. Just say the volume of the light source.
The light source structure has a feature. We designed this product to make the manufacture of the luminaire easier and the need for labor to be lower. Let the design of our luminaires be bolder, because it is small in size and can be chosen to be large and can be applied to any type of street lamp.
The performance of the light source is also continuously reduced, and the heat dissipation requirement is at least 10% lower than the conventional one. Assembly efficiency is increased by at least 20%, and the overall price/performance ratio is increased by at least 20%.
The overall efficacy of the luminaire is 110 to 140, and then it is absolutely possible to go to 170.
The waterproof rating is also very high. Withstand voltage, the LM-80 is currently in progress and will soon end.
This is the application on the street light. Due to its stability and structure, this product can be more casual, so he will be greatly extended in this application field, which is only a relatively subdivided field.
This product may not be accepted by the public, we are doing the direction of subdivision, these years have been in the field of street lights, explosion-proof lights, in 2014, also fully confirmed this, everyone gave a very high evaluation, the product The failure rate is very, very low.
At present, there are already many customer groups in the medical and automotive fields who are consulting and coordinating with us to do some design and development of the program.
In the military industry, for example, large searchlights require a very long exposure and a very concentrated concentration. Therefore, the flip chip product can achieve very concentrated density, and the lumen output is also very good, so even in the future, there are aerospace fields, etc., and it is possible to get a lot of applications.
For example, in the field of automotive lighting, the main headlights, for the chipping of this product, his shock resistance, stability, small size is more suitable for the development of this product.
There is also a medical field where the demand for light output and the stability of the electrical performance of the lamp are more demanding. Some customers have done very well in this field yesterday. If the flip chip product is applied to this product, it is even more.
At present, the packaging industry, everyone has been lifting the package, we have done at least 10 years in this industry, free of packaging is to avoid the field of our packaging, it is also possible. But it may not be so fast. We should have this kind of worrying consciousness as a packager. The whole packaging industry is currently in such a situation. We have some industry amnesties, strong capital, sufficient technical reserves, and very diverse talents and management. Great, walking in front, he must have triumphed all the way. Just now, Mr. Zhang also said what the industry will look like in the future. Therefore, I hope that in this industry, everyone will gradually move forward. I don’t want to see everyone falling down. When we see others running down, we are happy and lost. We are happy to have one competitor. How should we feel fearless?
Don't say the status quo, everyone is very clear. My personal thoughts on the future of packaging, but also I am ready to lead the team forward, is to extend downwards and extend outward.
The downward extension that I am talking about is also based on the position of the user standing on the customer's position, solving what he can't solve, or the extension of the field he wants to solve, but feels very troublesome.
Extending outwards is definitely a constant innovation, operating model, and marketing model.
Strong alliance, complementary advantages.
The fourth is that I have been prepared to do this. I am positioning myself. I am not a manufacturer. We are a service provider. It is to solve what we have just said, to solve problems that customers are not willing to solve, or to solve problems that they cannot solve. We use the accumulation of experience in the industry for so many years, and our understanding of the LED field to solve the problems he has to solve.
In the future, the market will definitely become bigger and bigger, so here, I wish all of you here in the LED industry to get better and better, and go further and further, thank you.
Zheng Xiantao emphasized that in the future, the realization of downward and outward extension, continuous innovation and change of mode, complementation of strong and strong joint advantages, and transformation from manufacturing service industry will become a direct and higher-speed train for LED packaging enterprises.
The following is the full text of Zheng Xiantao's speech:
Good afternoon, my colleagues.
I am very fortunate to be able to share some of my personal experiences with this platform. This is the first time that Getian has appeared in such a workplace. It has been a relatively low-key way and has been in the industry for ten years. The theme I brought today is "Flip-chip".
What new opportunities can the flip chip package bring to the market today? This is also the question that Getian began to think about three years ago. Because in the field of packaging, a product, a product has been done for almost ten years, in which direction does the package go?
Getian has always been doing some applications in the field of outdoor lighting, and also knows that outdoor lighting is very demanding on the stability of LED products, and it is suitable for different environments.
Another eternal theme is how to make it stable and cheap. Based on this starting point, I started researching the work of flip chip products three years ago.
What I brought today is also the product of Getian in the past three years. This product has gained some experience in the market.
My speech is divided into four major sections:
The first is the comparison of flip chip and traditional package.
Getian's point of view, flip chip packaging, or flip-chip, future application innovation. This is something we have a deep understanding of, can be unlimited innovation, and its stability, not to mention, cost-effective, the future cost space is very huge. It may not be imagined that if this thing is used on a street lamp to realize 3 yuan per watt, if all aspects of the package are in place, it must be realized.
As long as the downstream field wants to get it, I can do it. Of course, the future market expansion is infinite, and the reason is also based on the fact that stability has not been applied by the LED segment.
First look at the material, this material is also the core of the chip, we all know at a glance, Dr. Xiao just said very clearly.
The traditional chip is glued, but we are.
The gold-tin crystal process quickly fixes the chip by nearly 300 degrees of high temperature, while the traditional one takes a long time and the temperature is more than 120 degrees. The difference in thermal conductivity between silver paste, thermal conductivity and alloy material is close to 54 times. The thickness of the solid crystal silver paste is 30 microns in the middle of the chip, and the alloy is only 3 microns, which means that the heat in the middle is exported faster. There is also a special place where the solid crystal is stable. The thrust of the silver plastic package is 500 grams, while the soldering thrust of the fine tin crystal is at least 2000 grams.
The thermal conductivity of the substrate and ceramic is very high, and the thickness is also very high. The expansion coefficient is basically close to the expansion coefficient of the sapphire of the chip, which indicates that the internal stress generated by the chip after heat resistance causes the chip to be caused. The destruction has made this probability much lower.
The process of packaging, the conductive is gold-free, that is, package-free, eliminating the gold wire, that is to say, the positive and negative conductive cross-sectional area of ​​the traditional positive-loading chip may be 2.265 square meters. The bonding pressure is also the same, especially in the way the phosphor is applied, which is definitely affected by the gold wire, which has some effect on our coating method. At the top of the chip, when there is no gold wire, we can really play freely, whether it is a spray or a process mode.
In the packaging equipment, you may know that basically the wire bonding machine is basically not used, the efficiency will be greatly improved, one is the coating method of the phosphor, and the free gold wire will also make the efficiency much improved.
That is to say, the entire packaging process, packaging labor costs are reduced a lot.
The thermal resistance of the flip chip product is very low, and the solder layer of the alloy itself is very thin, which is directly transmitted by the heat between the electrode and the bottom plate, and also eliminates the risk of leakage of silver glue to the periphery of the chip. There is no such thing in the process of flip chip.
Looking at the streetlight modules that everyone can see on the market today, the assembly is more complicated, and the cost is definitely relatively difficult. In terms of labor cost and stability, it is difficult to make breakthroughs and changes, but if we use flip chip To replace it, first of all, it can reduce its volume, because the temperature resistance of this product is very high, so after the volume is small, the heat dissipation requirement will be high, the volume can be done very well, and the volume can be reduced. Half. Just say the volume of the light source.
The light source structure has a feature. We designed this product to make the manufacture of the luminaire easier and the need for labor to be lower. Let the design of our luminaires be bolder, because it is small in size and can be chosen to be large and can be applied to any type of street lamp.
The performance of the light source is also continuously reduced, and the heat dissipation requirement is at least 10% lower than the conventional one. Assembly efficiency is increased by at least 20%, and the overall price/performance ratio is increased by at least 20%.
The overall efficacy of the luminaire is 110 to 140, and then it is absolutely possible to go to 170.
The waterproof rating is also very high. Withstand voltage, the LM-80 is currently in progress and will soon end.
This is the application on the street light. Due to its stability and structure, this product can be more casual, so he will be greatly extended in this application field, which is only a relatively subdivided field.
This product may not be accepted by the public, we are doing the direction of subdivision, these years have been in the field of street lights, explosion-proof lights, in 2014, also fully confirmed this, everyone gave a very high evaluation, the product The failure rate is very, very low.
At present, there are already many customer groups in the medical and automotive fields who are consulting and coordinating with us to do some design and development of the program.
In the military industry, for example, large searchlights require a very long exposure and a very concentrated concentration. Therefore, the flip chip product can achieve very concentrated density, and the lumen output is also very good, so even in the future, there are aerospace fields, etc., and it is possible to get a lot of applications.
For example, in the field of automotive lighting, the main headlights, for the chipping of this product, his shock resistance, stability, small size is more suitable for the development of this product.
There is also a medical field where the demand for light output and the stability of the electrical performance of the lamp are more demanding. Some customers have done very well in this field yesterday. If the flip chip product is applied to this product, it is even more.
At present, the packaging industry, everyone has been lifting the package, we have done at least 10 years in this industry, free of packaging is to avoid the field of our packaging, it is also possible. But it may not be so fast. We should have this kind of worrying consciousness as a packager. The whole packaging industry is currently in such a situation. We have some industry amnesties, strong capital, sufficient technical reserves, and very diverse talents and management. Great, walking in front, he must have triumphed all the way. Just now, Mr. Zhang also said what the industry will look like in the future. Therefore, I hope that in this industry, everyone will gradually move forward. I don’t want to see everyone falling down. When we see others running down, we are happy and lost. We are happy to have one competitor. How should we feel fearless?
Don't say the status quo, everyone is very clear. My personal thoughts on the future of packaging, but also I am ready to lead the team forward, is to extend downwards and extend outward.
The downward extension that I am talking about is also based on the position of the user standing on the customer's position, solving what he can't solve, or the extension of the field he wants to solve, but feels very troublesome.
Extending outwards is definitely a constant innovation, operating model, and marketing model.
Strong alliance, complementary advantages.
The fourth is that I have been prepared to do this. I am positioning myself. I am not a manufacturer. We are a service provider. It is to solve what we have just said, to solve problems that customers are not willing to solve, or to solve problems that they cannot solve. We use the accumulation of experience in the industry for so many years, and our understanding of the LED field to solve the problems he has to solve.
In the future, the market will definitely become bigger and bigger, so here, I wish all of you here in the LED industry to get better and better, and go further and further, thank you.
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