Molex Introduces iPass+TM High Density Interconnect System

Molex Corporation announces a new integrated iPass+TM high-density interconnect system consisting of host-side board connectors, internal and external copper components, and active optical cables (AcTIve OpTIcal Cables, AOC) capable of transmitting up to 100 meters in length SAS 3.0, 12 Gbps signal. The enhanced iPass+ HD connection system has been specifically designed and manufactured to meet new speed and density performance standards.

Molex's new products are about twice as dense as existing QSFP+ solutions, making the iPass+ HD interconnect system suitable for large-scale data center and enterprise multi-rack storage systems, as well as Redundant Array of Individual Disks. RAID) and other data networking and storage applications. HD products are fully compatible with SAS 3.0 (12 Gbps) systems and backward compatible with SAS 2.1 (6 Gbps) systems.

The Molex iPass+ HD interconnect product line includes:

External passive copper cable assembly (4x and 8x)

Internal passive cable assembly (4x and 8x)

External integrated cage and socket (4x, 8x and 16x)

Internal right angle and vertical sockets (4x, 8x and 16x)

External Active Cable Assembly (4x AOC)

These products are also compatible with 10 Gbps InfiniBand QDR, 10 Gbps Ethernet, 8 Gbps Fiber Channel, 40 Gbps (4x10G) Ethernet, and 56 Gbps (4x14 Gbps) InfiniBand FDR data rates.

With a strong inventory, flexible policies, agile systems, extensive technical support and unparalleled customer service, Heilind supports original equipment manufacturers and contract manufacturers in all segments of the electronics industry. Products from the industry's top manufacturers, covering 25 different component categories, with a special focus on interconnect and electromechanical products.

Founded in 1974, Heilind Electronics has a global headquarters in Boston, USA, and has established more than 40 locations in China, Hong Kong, Singapore, the United States, Germany, Brazil, Canada and Mexico. Its main distribution products include interconnected devices, relays, fans, switches and sensors, circuit protection and thermal management, bushings and wire harness products, crystals and oscillators.

In December 2012, Helian Electronics officially launched its Asia Pacific business. The headquarters of Helian Asia Pacific is located in Hong Kong. In addition to the sales department, it also has a regional distribution center and a value-added service center. So far, Helian Asia Pacific has been in Hong Kong, Shanghai, Beijing, Suzhou, Nanjing, Xi'an, Dongguan, Chengdu, China. Xiamen, Taipei, Singapore, Malaysia, India, Thailand, Philippines, Vietnam, Indonesia and other places opened 19 branches and 2 warehouses (Hong Kong and Singapore). For more information, please visit;

Molex is the world's leading supplier of electronic connectivity devices, designing and developing innovative solutions for a variety of important products related to everyday life. The company has the highest number of product portfolios in the world, with more than 100,000 products, including electrical and fiber connectivity solutions to all aspects of switches and applications. Molex serves customers in a wide range of industries, including telecommunications, data communications, computer/peripherals, automotive, building wiring, industrial, consumer, medical and military markets. The company has the highest R&D investment level in the industry. Innovative products and solutions continue to be introduced in the areas of high-speed signal integrity, miniaturization, high-power transmission, optical signal transmission, and sealed connections for harsh environments. For more details, please visit WWW.MOLEX.COM.

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