Packaging technology innovation LED industry blindly imitate it is difficult to survive
At present, the LED industry is oversupply. When the manufacturers cut prices and competed fiercely in the market, Nichia, the global leading LED manufacturer, said in Taiwan that in the face of market vicious price competition, only continuous research and development of innovative technologies, In order to maintain a leading edge in the market.
Since the second half of 2010, its investment in China has begun to increase, and began to make high-profile appearances at professional exhibitions in China. Under the competition of major LED manufacturers around the world, the price-cutting situation in the two areas of backlighting and lighting will continue to be severe in 2016. At this stage, the LED industry, whether it is packaging or performance, is gradually moving to a higher level. If the industry just imitates the manufacture of existing products, it will be difficult to survive in the market.
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However, for the future of the LED industry, Akutagawa is still optimistic. He further pointed out that the LED industry will continue to grow in 2016. In the face of vicious price-cutting competition in the market, the key to the survival of enterprises lies in the development of “technologyâ€, and the company invests a lot every year. The funds and resources are engaged in innovative research and development, so mastering many important patented technologies has also become the company's advantage in the “Red Sea†wave.
Nichia's new FlipChip packaging technology is in turmoil. Nichia Chemicals (LED) faucet factory Nichia Chemicals uses the newly developed flip chip technology to create LED chips that can be directly mounted on the substrate, featuring miniaturization, high brightness, high stability, etc. It has entered mass production in October and is expected to become a new weapon for the company to break through in the LED Red Sea battle.
Taiwanese LED factory spokesperson Zhang Shixian said that the current market demand is not strong, but there are still many opportunities next year, especially next year CSP overlay is expected to become the mainstream of the market, the relevant technology barriers to entry, the revenue and profit will have A good note.
The gold-free flip chip packaging technology can effectively avoid various problems caused by gold wires, has better heat dissipation and high current resistance, and provides better thermal conductivity and heat dissipation area. Based on this flip chip process, it is convenient to realize multi-chip integration with high brightness requirements, COB (chip on board) modules and other products. Taking full advantage of the advantages of flip chip technology, yield and reliability must be the mainstream application of LED light source in the future.
Although many companies in the LED industry have withdrawn from the market this year and there have been mergers and acquisitions, 2016 will gradually move towards phase-out and consolidation. However, more companies are focusing on technology development. Even for small and medium-sized enterprises to avoid falling into unreasonable price wars, the key to survival is "technology." It is believed that in the future, flip chip packaging technology will give full play to its advantages in process, yield and reliability, and it will certainly become the mainstream application of LED light source in the future.
Die casting is the pressure of metal molds on a die casting machine and is the most productive casting process. Die-casting machines are divided into two categories: hot-chamber die-casting machines and cold-chamber die-casting machines. The hot chamber die casting machine has a high degree of automation, less material loss, and higher production efficiency than the cold chamber die casting machine. The aluminum alloy die castings that are widely used today can only be produced on cold chamber die casting machines due to their high melting point. The main feature of die casting is that the molten metal fills the cavity under high pressure and high speed, and is formed and solidified under high pressure. The air in the cavity is wrapped inside the casting to form subcutaneous pores, so aluminum alloy die castings should not be heat treated, and zinc alloy die castings should not be sprayed on the surface (but can be painted). Otherwise, the internal pores of the casting will expand due to thermal expansion and cause the casting to deform or bubble when the above-mentioned treatment is performed. In addition, the mechanical cutting allowance of die castings should also be smaller, generally around 0.5mm, which can not only reduce the weight of castings, reduce the amount of cutting to reduce costs, but also avoid penetrating the surface dense layer and exposing subcutaneous pores, causing The workpiece is scrapped.
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