4G chip manufacturers develop a focus on price-changing multi-mode multi-frequency

The demand for 4G mobile phones in China has slowly come, and 4G mobile phone chip suppliers have launched a fierce contest as an important participant in the 4G feast. Some media reported that in order to occupy a favorable position in the 4G chip market, Qualcomm, MediaTek and Marvell will increase the shipment of 4G chips in the third quarter of this year at the expense of their gross profit.

However, at present, the domestic 4G mobile phone chip market is basically occupied by Qualcomm, and domestic chip manufacturers want to suppress it, which is obviously not easy. At present, 4G terminals supporting LTE/3G multi-mode multi-frequency have become a clear direction for the development of the industry, which gives the domestic chip manufacturers the direction of breakthrough - multi-mode multi-frequency, low-power and high-integration LTE chips. To this end, domestic chip manufacturers need to accelerate the development speed of multi-mode multi-frequency 4G chips, in order to obtain greater breakthroughs in the 4G market.

4G mobile phone chip price impulse

2014 is the first year of 4G, and the 4G license is pushing the communications industry to “change the dynasty”, and 4G will become the standard for consumers. According to the "2013-2017 Global Smartphone Industry Market Outlook and Investment Opportunity Analysis Report", the fourth quarter of 2014 to 2015 will be the year of China's 4G mobile phone explosion, and the high-end market will set off a new wave of exchanges. Market research firm IHS also made an estimate: In 2014, China's 4G smartphone market will grow substantially, and its shipments are expected to increase 15 times compared with 2013; and, in the next few years, China's 4G smartphones There will be an unstoppable growth trend in the market: by 2015, its shipments are expected to double from 2014 to 144.1 million units; in 2016, it is expected to increase further by 53% to 219.8 million units; by the end of 2017 It is expected to reach 298.5 million units.

The heat of global 4G construction is heating up. China is the largest 4G market, and behind the fierce smashing of 4G mobile phone terminals, a battle for chip makers is also taking place. Recently, it is reported that smartphone solution providers including Qualcomm, MediaTek and Marvell expect to increase 4G chip shipments in the third quarter of 2014 at the expense of their gross profit. Qualcomm has announced that it will cut prices to promote 4G mobile phone chips, and the industry even speculated that the offer is likely to fall below the $20 mark. The 4G mobile phone chip is similar to the new 4G mobile phone product, and there is no price difference with the 3G mobile phone product, forcing the terminal customer to fully upgrade the 4G technical specifications. In the face of Qualcomm's price cuts, MediaTek and Marvell also followed, making the price of 4G mobile phone chips drop by about 20% at the end of the second quarter and the beginning of the third quarter.

According to industry insiders, the upstream wafer foundry capacity is still tight at this stage, but the 4G mobile phone chip quotation has continued to decline, indicating that the competitive pressure of the 4G mobile phone chip market is quite large, which shows a scene of continuous price hikes to seize market share. . The industry expects that the price decline and the range of 4G mobile phone chip prices in the second half of 2014 will be even higher than that in the first half of the year. This will also cause the three major mobile phone chip manufacturers to fall into the dilemma of 4G mobile phone chip shipments and lower gross profit margin.

Mobile phone chip market is killing fiercely

The intensification of competition in the mobile chip market and the development of the smart phone market are simultaneous. When manufacturers compete fiercely, they are more likely to adopt a price war strategy. The price is lower and the profit margin of the chip is repeatedly compressed. The industry believes that with the continuous upgrading of market competition and the accelerated promotion of 4G mobile phones, the future market will evolve into an all-round competition of capital, technology and scale. Under the effect of shuffling, there will be only two or three oligarchs. At present, Qualcomm, which is fully equipped with the advantages of technology, capital and scale, is far superior to competitors in terms of mobile phone chip-related AP and baseband chips, and important SoC integration capabilities.

MediaTek launched a fierce attack on Qualcomm, in addition to occupying the low-end market, it is also moving towards the high-end market. According to IDC's latest “China Smart Terminal Market Quarterly Tracking Report (1st Quarter 2014)” data, the chip maker Zhonglianke has increased its market share in smart terminals, reaching 34.6% in the first quarter of 2014. Especially in the low-end market (below $300), MediaTek’s share is around 50%. Qualcomm, ranked second, still maintains a clear advantage in the mid to high-end market ($100 and above). In the high-end market ($300 and above), traditional well-known chip makers such as Qualcomm, Intel, AMD, and Apple have gathered here.

The fierce killing in the chip field may be a reshuffle of the brewing market pattern. The 4G era has arrived. On the one hand, the industry is filled with the ambitions of domestic mobile phone manufacturers to plan and market, but on the other hand, there is a message of tight supply of mobile phone chips and high-end components. Industry experts said that domestic mobile phone manufacturers should be strong, and full involvement in chip research and development is imperative. This requires Huawei, ZTE and MediaTek to strengthen their independent innovation and accelerate the development of multi-mode multi-frequency mobile phone chips needed in the 4G market.

Support LTE/3G multi-mode multi-frequency into focus

Currently supporting LTE/3G multi-mode multi-frequency is a clear development direction of LTE terminals, and it is also the development idea of ​​domestic operators. At present, some operators in China have publicly stated that they will build a TDD/FDD converged networking network, which puts high demands on multi-mode multi-frequency. China Mobile has also repeatedly stressed that TDD/FDD hybrid networking, support for 5 mode 10 frequency, 5 mode 12 frequency and Band 41 is the focus of China Mobile's development of LTE intelligent terminals. Market research analysts said that in view of the current status of China's communications industry, there will be 4G networks plus three different 3G standards for three operators, and even compatible with the market structure of 2G GSM and CDMA networks. Modular multi-frequency will become the inevitable standard for 4G mobile phones.

The inconsistency of frequency bands is the biggest obstacle to the design of LTE terminals in the world today. The diversity of global 2G, 3G and 4G LTE network bands poses a challenge to mobile terminal development. Multi-mode multi-frequency, low power consumption and high integration have become the development of LTE chips. Important thresholds and difficulties. Currently, global 2G and 3G technologies use 4 to 5 different frequency bands, and with 4G LTE, the total number of network bands is nearly 40. To support multi-mode multi-frequency, you first need to integrate terminals that can support multiple standards and frequency bands. Undoubtedly, all of this has set an unprecedented challenge for the current level of LTE communication processor chip technology.

Therefore, for the domestic mobile phone chip makers, the card 4G chip market is both an opportunity and a challenge. Only by strengthening technological innovation and accelerating the development of multi-mode multi-frequency, domestic manufacturers can occupy a favorable position in the fierce competition of the future 4G market. . After all, only manufacturers who can design their own chips will not be subject to people everywhere, and they are truly powerful mobile phone manufacturers.

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Ethernet Passive Optical Network (EPON), as the name implies, is a PON technology based on Ethernet. It adopts point-to-multipoint structure, passive optical fiber transmission, and provides multiple services on Ethernet. EPON technology is standardized by the IEEE802.3 EFM working group. In June 2004, the IEEE802.3EFM working group released the EPON standard-IEEE802.3ah (incorporated into the IEEE802.3-2005 standard in 2005). In this standard, the Ethernet and PON technologies are combined, the PON technology is used in the physical layer, the Ethernet protocol is used in the data link layer, and the PON topology is used to realize Ethernet access. Therefore, it combines the advantages of PON technology and Ethernet technology: low cost, high bandwidth, strong scalability, compatibility with existing Ethernet, and convenient management.


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The concept of Passive Optical Network (PON) has a long history. It has the characteristics of saving optical fiber resources and being transparent to network protocols, and it plays an increasingly important role in optical access networks. At the same time, after two decades of development, Ethernet technology has almost completely dominated the local area network with its simple, practical, and low-cost characteristics, and has in fact proved to be the best carrier for carrying IP data packets. As the proportion of IP services in metro and trunk transmission continues to rise, Ethernet is also gradually penetrating access, metro and even backbone networks through improvements in transmission rate and manageability. The combination of Ethernet and PON resulted in the Ethernet Passive Optical Network (EPON). It has the advantages of Ethernet and PON at the same time, and is becoming a popular technology in the field of optical access networks.



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