"Chip factory + application plant" model is expected to increase CSP market share
Since entering 2016, the “gateway†of the CSP market is gradually being opened...
CSP strong winds stir the entire LED packaging market, is leading a major change in the current LED lighting industry.
In fact, since its inception, CSP has been frequently questioned by the industry. Some people say that CSP is just a concept of everyone's sizzling, it is difficult to achieve landing; others said that CSP price is too high, can not be widely accepted by users; others said that CSP yield problems are difficult to solve, resulting in cost pressure and other issues .
Then, whether CSP will have a chance to achieve market breakthrough in the future will take some time to observe.
CSP challenges SMD, the market potential is huge
But CSP will be the final trend, which is beyond doubt. The smaller the brighter the more cheap, the more has become the development trend of LED. From the perspective of technology and product evolution, CSP is a kind of terminal that will inevitably replace SMD package.
Since it is the final trend, it is definitely the market for SMD LEDs and POWER LEDs. This market is now the market share of hundreds of billions of LEDs. At present, CSP is gradually becoming the hegemon and monopoly.
Many people believe that CSP is the first to be applied in the field of backlight and high power, and the space is also mainly in the backlight market.
Chen Yongping, general manager of Donghao Optoelectronics Co., Ltd. believes that “CSP is in the special application field of display backlight, plant lighting, automotive lighting (headlights), medical lighting, etc., which have strict requirements on product size and performance. The general lighting market also has huge room for development."
Indeed, CSP applications are very broad and can cover almost all LED applications, which cannot be achieved by other packaging formats, so more and more fields will gradually use CSP.
"Chip Factory + Application Factory", CSP can break through in the future
For how to reasonably reduce the price of LEDs and reduce production costs, LED companies have made their own eye-catching skills, especially in the field of LED packaging. Even in the first half of the year, they launched three "revolutions."
The so-called "three no" products are no package, no heat, no power, the simpler the better! CSP is in line with this trend, the design structure is simplified.
“Dongyu Optoelectronics has been focusing on this and CSP field for many years, and has achieved the advantages of no support, no gold wire, small size, etc.†Chen Yongping told Gaogong LED.
From the performance point of view, CSP can not only solve the development of package size miniaturization and improve the heat dissipation problem, but also realize the simplification and miniaturization of a single device package, which can greatly reduce the material cost of each device, so the production capacity of mass production is very high. Big.
In addition, CSP conforms to the "chip factory + application" model, eliminating the packaging process, shortening the industrial chain, reducing the overall distribution cost, and making the LED price closer to the people.
All in all, the LED lighting industry has gradually matured from the spur of the moment, and the discussion on standardization has never stopped. The original LED high-power products were highly homogenized. After the emergence of CSP, they gradually gained certain recognition in the market, and the development trend was good.
It is worth mentioning that the package change seminar hosted by Gaogong LED will be held on September 9 (Friday) Shenzhen Qingqing World. At that time, Chen Jiang, deputy general manager of Dongpuguang Electronics, will discuss with you the "the next era of CSP."
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