Ultra-high efficiency ratio low VF Schottky rectifier

NXP Semiconductors NXP Semiconductors N. V. (NASDAQ: NXPI) recently introduced the DFN1006D-2 (SOD882D), the highest energy-efficient Schottky rectifier in a 1.0 x 0.6 x 0.37-mm ultra-small flat SMD plastic package. This 20-V, 0.5-A PMEG2005BELD Schottky Barrier Rectifier is the smallest device on the market with a maximum forward voltage of 390 mV at a forward current of 0.5-A, which significantly improves battery life and performance. This low VF Schottky rectifier has excellent electrical performance and is ideal for battery-powered mobile devices such as smartphones and tablets that require reduced overall power consumption in a limited PCB space. This ultra-compact Schottky rectifier combines low forward voltage with low reverse current, with only 50μA reverse current at 10-V reverse voltage. It is a backlit display for smartphones, MP3 players, tablets, etc. The ideal choice.

Dr. Wolfgang Bindke, Marketing Manager of NXP Diode Products, said: “In today’s smart phones, the space on the circuit board is very limited. We designed this latest low VF Schottky rectifier to meet the needs of customers, and it will be twice as large. The product's features are integrated into a small 1006 (0402) plastic package with no compromise in performance.The small leadless package is 20% more efficient than comparable products, and we have set a new low positive Voltage standard. In order to achieve these excellent electrical parameters, we have optimized the silicon wafer process and package line."

The PMEG2005BELD is powerful and compact, with NXP's unique tin-plated solderable side pads. These tin-plated side pads support visual inspection of solder joints and are therefore more attractive to manufacturers. At the same time, with the solderable side pads, the gap between the board and the PCB can be reduced, the tilt can be reduced, and the shear robustness can be improved.

The main features

Average Forward Current: IF(AV)≤0.5 A

Reverse voltage: VR ≤ 20 V

Low forward voltage: VF ≤ 390 mV (0.5 A forward current IF)

Low reverse current: IR≤50μA (10V reverse voltage VR)

Meets the automotive industry standard AEC-Q101=

Key advantages

Low forward voltage results in lower power consumption, which in turn extends battery life

Ultra-small size, high PCB packaging density, excellent thermal conductivity

Extremely low device height (0.37 mm), short PCB stack, high stacking density

The DFN1006D-2 (SOD882D) package uses tin-plated side pads to allow optical inspection of solder joints