As PoE achieves power supply of around 100W, the application range of Ethernet is expanding. Among them, the control of LED lighting is the most concerned. In the future, it will become a key component of the popularity of BEMS.
The use of Power over Ethernet (PoE) powered by Power over Ethernet is growing (Figure 1). In fact, since the standard specification "IEEE802.3af" was established in PoE in June 2003, the scope of application has begun to expand. The IEEE802.3af has a maximum voltage of 57V, and one port can output 15.4W of power and can supply 12.95W to the power receiving side. Later, in June 2009, a "IEEE802.3at (PoE+)" standard with a port that can be powered by 25.5W was developed, and the support model was further increased. At present, the use of IP phones, surveillance cameras and wireless LAN access points in office buildings is increasing.
Figure 1: PoE boosts large power
"PoE" conforming to the IEEE standard specification, a port generally outputs 15.4 to 34 W of power, but now there is a technology that can supply more power. Inevitable Cisco system "UPoE" and Linear Technology's "LTPoE++" and so on.
Recently, PoE technology that can supply more than 25.5W of power specified by IEEE802.3at has been put into practical use. Among them, the "LTPoE++" of Linear Technology, Inc., which can supply about 100W of large power. One port on the power supply side can output 125W and receive 90W of power.
IEEE 802.3af and IEEE 802.3at utilize two of the four pairs of twisted pairs in the Ethernet cable. LTPoE++ improves the supply of electricity by using all four pairs (Figure 2). As power is increased, the company has introduced a function of detecting voltage and current values ​​in the power supply control IC in order to improve reliability. In addition, to reduce the amount of heat generated, an external standard that selects a low-loss MOSFET is used. According to Linear Technology, as power increases, it can be used in small base stations for mobile communications. It is expected that small base stations equipped with LTPoE++PoE control ICs will be unveiled from the end of 2012 to 2013.
Figure 2: Using 4 pairs of twisted pairs to supply large power
A port that can output more than 34W of large power specifications utilizes all 4 pairs of twisted pairs in the Ethernet cable.
Electronic design is also trying to reduce its size while continuously improving the performance of the whole machine. From mobile phones to smart small portable products, small is always the same pursuit. High-density integration (HDI) technology enables end-product design to be more compact while meeting higher standards of electronic performance and efficiency. HDI is currently widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured using a build-up method. The more times the layers are stacked, the higher the technical grade of the board. Ordinary HDI boards are basically one-time laminate, high-order HDI uses two or more layers of technology, and adopts advanced PCB technology such as stacking holes, plating holes, and laser direct drilling. High-end HDI boards are mainly used in 3G mobile phones, advanced digital video cameras, IC carrier boards, etc.
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