Samsung pushes low-grade large-capacity server memory

Samsung has announced that it has successfully developed its first single 16GB VLP (very low profile) memory stick that will be unveiled in conjunction with IBM's H22V blade server system demonstrated at VM World 2010.

Although Samsung did not release a physical photo of the memory module, it has confirmed that its height is 18.75mm, which has been reduced by more than one-third compared to the full-height memory of about 30mm. At such a high level, Samsung achieved a 16GB terrible capacity by using a 40nm class dual die package (DDP) 4Gb memory chip. Allegedly, a single 16GB memory can save 70% of 4 4GB of memory and 40% of the energy compared to two 8GB of memory. Because the memory is 1.35V low voltage version DDR3, it can save 20% energy compared with 1.5V DDR3 and 80% energy saving with 1.8V DDR2.

IBM's HS22V blade server is based on the Intel Xeon 5600 series processor. After using Samsung's single 16GB memory, the maximum memory capacity can be expanded to 288GB.