In the electronics industry, although each company must pursue its own interests, they have a common interest in addressing the vulnerability of SMT lead-free soldering and related issues, especially considering the transition to none. The timeline for lead soldering technology is very short.
In order to solve the problem currently facing the electronics industry, the 'association' concept may be very applicable. The association's efforts can protect its member companies from ignoring critical phenomena or opinions. The association can also act as a public forum, advocate for sound infrastructure improvements, and provide the solutions necessary to solve these problems.
The mechanical stress on the solder joint originates from the external force applied on the board or the mismatched thermal expansion inside the soldered structure. At sufficiently high pressures, the creep properties of the solder help to limit stress within the solder joint. Even a typical thermal cycle typically requires several solder joints to withstand the load that causes creep during each thermal cycle. Therefore, the structure of the intermetallic compound on the pad must withstand the load caused by solder creep. . In the case of a mechanical load, especially the load caused by mechanical shock of the system, the creep stress of the solder is always relatively large, because the load is applied to the solder joint at a relatively high deformation speed. Therefore, even an intermetallic compound structure that is sufficiently resistant to thermal cycling will eventually become the most vulnerable joint during shear or tensile testing.
Because the applied mechanical load can often be designed to limit it so as not to cause too much solder creep, or at least not to cause breakage at the solder joint. Nonetheless, in these tests, the crack from the penetration of the solder to the surface of the pad or the break of the intermetallic compound is an indication of constant embrittlement. In general, welding that exhibits brittle interface cracking without significant plastic deformation is an inherent problem in many applications where solder joint impact loads are foreseeable. Under these circumstances, almost no energy in the solder joint can be dissipated during the fracture process, so the structure of the solder joint is naturally prone to impact strength problems.
Pcb Spring Terminal Blocks,Plug-In Terminal Block Connector,Pcb Plug-In 6Pin Terminal Block,Pcb 5.0Mm Wiring Type Terminal Block
Shenzhen Hongyian Electronics Co., Ltd. , https://www.hongyiancon.com