OSRAM Opto Semiconductors Introduces 6-Inch Wafer Expansion Capacity
March 7, 2011 -- China News - OSRAM Opto Semiconductors has expanded its two chip manufacturing plants while upgrading them to a 6-inch wafer manufacturing facility to significantly increase production. Among them, a production building is being built at the Penang base in Malaysia, while the existing plant in Regensburg, Germany is being redeployed. Both bases will adopt new manufacturing techniques to introduce 6-inch wafers to replace current 4-inch wafers. After taking these measures, by the end of 2012, the output of white LED chips will be expected to double.
Through this series of initiatives, OSRAM Opto Semiconductors will expand its production capacity in the two chip manufacturing bases in Regensburg and Penang in response to the growth potential of the international LED market, further consolidating its leading position in the international market. Less than two years after its opening in Penang, the Penang chip manufacturing facility is now welcoming the opportunity to expand to a 6-inch wafer fabrication facility. The total plant area will rise to 25,000 square meters in 2012, adding 400 new jobs. At the Regensburg site, the available space will be re-planned, and the production of InGaN (Indium Gallium Nitride) will be gradually upgraded as early as the summer of 2011.
Mr. Aldo Kamper, CEO of OSRAM Opto Semiconductors, said: “By expanding the capacity of high-performance InGaN chips, we are continuing to strengthen our market position. The LED market has great growth potential in many different applications and we will continue to use it. This driving force continues to grow. OSRAM Opto Semiconductors is an important part of OSRAM's LED technology value-added chain."
This capacity expansion will mainly affect InGaN chips using thin film and UX:3 technology, which is necessary for the production of white LEDs. In the future, these chips will be fabricated on 6-inch wafers from the start, and will no longer be based on current 4-inch diameter wafers.
Through this series of initiatives, OSRAM Opto Semiconductors will expand its production capacity in the two chip manufacturing bases in Regensburg and Penang in response to the growth potential of the international LED market, further consolidating its leading position in the international market. Less than two years after its opening in Penang, the Penang chip manufacturing facility is now welcoming the opportunity to expand to a 6-inch wafer fabrication facility. The total plant area will rise to 25,000 square meters in 2012, adding 400 new jobs. At the Regensburg site, the available space will be re-planned, and the production of InGaN (Indium Gallium Nitride) will be gradually upgraded as early as the summer of 2011.
Mr. Aldo Kamper, CEO of OSRAM Opto Semiconductors, said: “By expanding the capacity of high-performance InGaN chips, we are continuing to strengthen our market position. The LED market has great growth potential in many different applications and we will continue to use it. This driving force continues to grow. OSRAM Opto Semiconductors is an important part of OSRAM's LED technology value-added chain."
This capacity expansion will mainly affect InGaN chips using thin film and UX:3 technology, which is necessary for the production of white LEDs. In the future, these chips will be fabricated on 6-inch wafers from the start, and will no longer be based on current 4-inch diameter wafers.
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